Microchip M2GL060-FCSG325

安装类型

表面贴装

包装/外壳

325-TFBGA, FCBGA

表面安装

YES

供应商器件包装

325-FCBGA (11x11)

终端数量

325

Number of I/Os

200

Package

Tray

Base Product Number

M2GL060

厂商

微芯片技术

Product Status

活跃

Number of Logic Elements

56520 LE

Maximum Operating Temperature

+ 85 C

Supply Voltage-Max

1.2 V

Minimum Operating Temperature

0 C

Supply Voltage-Min

1.2 V

Mounting Styles

SMD/SMT

Package Description

BGA,

Package Style

网格排列

Risk Rank

1.54

Ihs Manufacturer

MICROSEMI CORP

Part Life Cycle Code

活跃

Manufacturer

Microsemi Corporation

Package Shape

SQUARE

Package Code

BGA

Manufacturer Part Number

M2GL060-FCSG325

Rohs Code

有

Operating Temperature-Max

85 °C

Reflow Temperature-Max (s)

30

Supply Voltage-Nom

1.2 V

Package Body Material

PLASTIC/EPOXY

Moisture Sensitivity Levels

3

操作温度

0°C ~ 85°C (TJ)

系列

IGLOO2

HTS代码

8542.39.00.01

电压 - 供电

1.14V ~ 2.625V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

260

Reach合规守则

compliant

JESD-30代码

S-PBGA-B325

温度等级

OTHER

数据率

667 Mb/s

可编程逻辑类型

现场可编程门阵列

逻辑元件/单元数

56520

总 RAM 位数

1869824

收发器数量

2 Transceiver