Microchip MAX24705EXG

表面安装

YES

终端数量

81

Package Description

LBGA, BGA81,9X9,40

Package Style

GRID ARRAY, LOW PROFILE

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA81,9X9,40

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

1.8 V

Supply Voltage-Min

1.71 V

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

MAX24705EXG+

Package Code

LBGA

Package Shape

SQUARE

Manufacturer

Microsemi Corporation

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Supply Voltage-Max

1.89 V

Risk Rank

5.79

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

BALL

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B81

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

CLOCK GENERATOR, PROCESSOR SPECIFIC

电源电流-最大值

575 mA

座位高度-最大

1.47 mm

主时钟/晶体频率-名

50 MHz

输出时钟频率-最大值

750 MHz

宽度

10 mm

长度

10 mm