Microchip MCRF200-I/PFFF

触点镀层

Tin

表面安装

NO

房屋材料

Liquid Crystal Polymer (LCP)

终端数量

8

Maximum Operating Temperature

+ 105 C

Minimum Operating Temperature

- 40 C

Factory Pack QuantityFactory Pack Quantity

950

Mounting Styles

PCB 安装

Contact Materials

Brass

Manufacturer

TE Connectivity

Brand

TE Connectivity

Package Style

IN-LINE

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP8,.3

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

MCRF200-I/PFFF

Package Code

DIP

Package Shape

RECTANGULAR

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICROCHIP TECHNOLOGY INC

Risk Rank

5.92

JESD-609代码

e0

定位的数量

14 Position

端子表面处理

Tin/Lead (Sn/Pb)

应用

Power, Signal

行数

1 Row

子类别

Headers & Wire Housings

螺距

1.5 mm

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

终端样式

焊针

JESD-30代码

R-PDIP-T8

资历状况

不合格

触点性别

Pin (Male)

房屋颜色

Natural

温度等级

INDUSTRIAL

产品类别

Headers & Wire Housings

通信IC类型

电信电路

产品

Headers

安装角

Straight

产品类别

Headers & Wire Housings

可燃性等级

UL 94 V-0