Microchip MD46802AE

表面安装

NO

终端数量

40

Package Style

IN-LINE

Package Shape

RECTANGULAR

Package Equivalence Code

DIP40,.6

Package Code

DIP

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Risk Rank

5.88

Package Description

DIP, DIP40,.6

Ihs Manufacturer

ZARLINK SEMICONDUCTOR INC

Part Life Cycle Code

Transferred

Rohs Code

无

Manufacturer Part Number

MD46802AE

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T40

资历状况

不合格

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

MICROPROCESSOR, RISC

位元大小

8