Microchip MEC1404-SZ

工厂交货时间

24 Weeks

生命周期状态

Production (Last Updated: 2 years ago)

表面安装

YES

终端数量

144

Manufacturer Part Number

MEC1404-SZ

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROCHIP TECHNOLOGY INC

Package Description

FBGA,

Risk Rank

5.03

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

Supply Voltage-Max

3.465 V

Supply Voltage-Nom

3.3 V

RoHS

Non-Compliant

Supply Voltage-Min

3.135 V

HTS代码

8542.31.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

0.65 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B144

温度等级

COMMERCIAL

uPs/uCs/外围ICs类型

微处理器电路

座位高度-最大

1.8 mm

长度

9 mm

宽度

9 mm