Microchip MEC1703H-C1-SZ

表面安装

YES

终端数量

144

Manufacturer Part Number

MEC1703H-C1-SZ

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROCHIP TECHNOLOGY INC

Package Description

VFBGA,

Risk Rank

5.09

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

VFBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Supply Voltage-Max

1.89 V

Supply Voltage-Nom

1.8 V

Supply Voltage-Min

1.71 V

Usage Level

Automotive grade

附加功能

ALSO OPERATES AT 3.3V NOMINAL

HTS代码

8542.31.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

0.65 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B144

温度等级

COMMERCIAL

uPs/uCs/外围ICs类型

微处理器电路

座位高度-最大

0.8 mm

筛选水平

TS 16949

长度

9 mm

宽度

9 mm