Microchip MX852EB0136

表面安装

YES

终端数量

38

Package Description

LGA-38

Package Style

GRID ARRAY, HEAT SINK/SLUG

Package Body Material

UNSPECIFIED

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

2.5 V

Reflow Temperature-Max (s)

未说明

Supply Voltage-Min

2.375 V

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

MX852EB0136

Package Code

HLGA

Package Shape

RECTANGULAR

Manufacturer

Microchip Technology Inc

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROCHIP TECHNOLOGY INC

Supply Voltage-Max

2.625 V

Risk Rank

5.79

ECCN 代码

EAR99

附加功能

IT ALSO OPERATES AT 3.3V NOMINAL SUPPLY

HTS代码

8542.39.00.01

技术

CMOS

端子位置

BOTTOM

终端形式

BUTT

峰值回流焊温度（摄氏度）

未说明

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

R-XBGA-B38

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

CLOCK GENERATOR, OTHER

座位高度-最大

1.45 mm

输出时钟频率-最大值

100 MHz

宽度

5 mm

长度

7 mm