Microchip VSC7432XIH

表面安装

YES

终端数量

672

Package Description

BGA,

Package Style

网格排列

Package Body Material

PLASTIC/EPOXY

Manufacturer Part Number

VSC7432XIH

Package Code

BGA

Package Shape

SQUARE

Manufacturer

Microsemi Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.67

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BALL

功能数量

1

Reach合规守则

compliant

JESD-30代码

S-PBGA-B672

通信IC类型

电信电路