Microchip VSC9110SA

表面安装

YES

终端数量

256

RoHS

Non-Compliant

Package Description

LBGA,

Package Style

GRID ARRAY, LOW PROFILE

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

VSC9110SA

Package Code

LBGA

Package Shape

SQUARE

Manufacturer

Vitesse Semiconductor Corporation

Part Life Cycle Code

Transferred

Ihs Manufacturer

VITESSE SEMICONDUCTOR CORP

Risk Rank

8.45

Part Package Code

BGA

HTS代码

8542.39.00.01

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

1.27 mm

引脚数量

256

JESD-30代码

S-PBGA-B256

资历状况

不合格

温度等级

INDUSTRIAL

座位高度-最大

1.67 mm

通信IC类型

ATM/SONET/SDH NETWORK INTERFACE

宽度

27 mm

长度

27 mm

达到SVHC

compliant