Microchip WED3C7410E16MC-450BH9M

表面安装

YES

终端数量

255

Manufacturer Part Number

WED3C7410E16MC-450BH9M

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Package Description

BGA, BGA255,16X16,50

Risk Rank

5.8

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC

Package Code

BGA

Package Equivalence Code

BGA255,16X16,50

Package Shape

SQUARE

Package Style

网格排列

端子位置

BOTTOM

终端形式

BALL

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

S-XBGA-B255

资历状况

不合格

电源

1.8,2.5,3.3 V

温度等级

MILITARY

速度

450 MHz

uPs/uCs/外围ICs类型

MICROPROCESSOR, RISC

位元大小

64