Microchip Technology AGL600V2-FGG144

包装/外壳

FBGA

安装类型

表面贴装

表面安装

YES

供应商器件包装

144-FPBGA (13x13)

终端数量

144

Unit Weight

0.014110 oz

Tradename

IGLOOe

Factory Pack QuantityFactory Pack Quantity

160

Moisture Sensitive

有

Maximum Operating Frequency

526.32 MHz, 892.86 MHz

Mounting Styles

SMD/SMT

Maximum Operating Temperature

+ 70 C

Minimum Operating Temperature

0 C

Supply Voltage-Min

1.14 V

Number of I/Os

97 I/O

RoHS

Details

Shipping Restrictions

This product may require additional documentation to export from the United States.

Typical Operating Supply Voltage

1.2, 1.5 V

Minimum Operating Supply Voltage

1.14 V

Maximum Operating Supply Voltage

1.575 V

Package

Tray

Base Product Number

AGL600

厂商

微芯片技术

Product Status

活跃

Supply Voltage-Max

1.575 V

Package Description

LBGA,

Package Style

GRID ARRAY, LOW PROFILE

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Supply Voltage-Nom

1.2 V

Reflow Temperature-Max (s)

40

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

AGL600V2-FGG144

Clock Frequency-Max

108 MHz

Package Code

LBGA

Package Shape

SQUARE

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

1.42

包装

Tray

系列

AGL600V2

操作温度

0 to 70 °C

JESD-609代码

e1

端子表面处理

Tin/Silver/Copper (Sn/Ag/Cu)

HTS代码

8542.39.00.01

技术

CMOS

电压 - 供电

1.14V ~ 1.575V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

260

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B144

资历状况

不合格

工作电源电压

1.2 V to 1.5 V

温度等级

OTHER

组织结构

13824 CLBS, 600000 GATES

座位高度-最大

1.55 mm

可编程逻辑类型

现场可编程门阵列

逻辑元件/单元数

13824

总 RAM 位数

110592

阀门数量

600000

速度等级

STD

逻辑块数量

13824

等效门数

600000

宽度

13 mm

长度

13 mm

高度

1.05 mm