Microchip Technology AT25DF321-S3U

表面安装

YES

终端数量

16

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

HTS

8542.32.00.71

Automotive

Unknown

PPAP

Unknown

Chip Density (bit)

32M

Block Organization

Symmetrical

Address Bus Width (bit)

24

Number of Bits/Word (bit)

8

Number of Words

4M

Programmability

有

Timing Type

Synchronous

Max. Access Time (ns)

6

Maximum Erase Time (S)

56/Sector

Maximum Programming Time (ms)

0.006(Typ)/Byte

Interface Type

Serial-SPI

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Programming Voltage (V)

2.7 to 3.6

Operating Current (mA)

16

Program Current (mA)

18

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

有

ECC Support

无

Support of Page Mode

有

Minimum Endurance (Cycles)

100000

Mounting

表面贴装

Package Height

2.35(Max)

Package Width

7.5

Package Length

10.3

PCB changed

16

Supplier Package

SOIC W

Package Description

SOP, SOP16,.4

Package Style

小概要

Moisture Sensitivity Levels

2

Number of Words Code

4000000

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

SOP16,.4

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

40

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

AT25DF321-S3U

Clock Frequency-Max (fCLK)

70 MHz

Package Code

SOP

Package Shape

RECTANGULAR

Manufacturer

Atmel Corporation

Part Life Cycle Code

Obsolete

Samacsys Description

Serial Flash Memory

Ihs Manufacturer

ATMEL CORP

Risk Rank

8.54

Part Package Code

SOIC

JESD-609代码

e3

零件状态

Obsolete

ECCN 代码

3A991.B.1.A

类型

NOR型号

端子表面处理

Matte Tin (Sn)

HTS代码

8542.32.00.51

子类别

闪存

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

功能数量

1

端子间距

1.27 mm

Reach合规守则

compliant

引脚数量

16

JESD-30代码

R-PDSO-G16

资历状况

不合格

电源电压-最大值(Vsup)

3.6 V

电源

3/3.3 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

2.7 V

操作模式

SYNCHRONOUS

电源电流-最大值

0.016 mA

建筑学

Sectored

组织结构

4MX8

座位高度-最大

2.65 mm

内存宽度

8

待机电流-最大值

0.000025 A

记忆密度

33554432 bit

并行/串行

SERIAL

内存IC类型

FLASH

编程电压

2.7 V

串行总线类型

SPI

耐力

100000 Write/Erase Cycles

数据保持时间

20

写入保护

HARDWARE/SOFTWARE

行业规模

64Kbyte x 64

页面尺寸

256byte

引导模块

无

宽度

7.5 mm

长度

10.3 mm