Microchip Technology ATMXT336U-MAU021

表面安装

YES

终端数量

56

ECCN (US)

EAR99

Number of Keys

8 Key

Resolution (bit)

8

Maximum Load Capacitance (pF)

3

Spread Spectrum

无

Interface Type

I2C/SPI

Minimum Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

3.3

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Package

XQFN EP

Mounting

表面贴装

Package Height

0.35(Max)

Package Length

6

Package Width

6

PCB changed

56

Package Description

HVQCCN, LCC56,.24SQ,14

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

LCC56,.24SQ,14

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

30

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

ATMXT336U-MAU021

Supply Voltage-Nom (Vsup)

3.3 V

Package Code

HVQCCN

Package Shape

SQUARE

Manufacturer

Microchip Technology Inc

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROCHIP TECHNOLOGY INC

Risk Rank

5.03

包装

Tray

零件状态

活跃

类型

Capacitive

HTS代码

8542.39.00.01

端子位置

QUAD

终端形式

BALL

峰值回流焊温度（摄氏度）

260

功能数量

1

端子间距

0.35 mm

Reach合规守则

compliant

引脚数量

56

JESD-30代码

S-XQCC-N56

电源电压-最大值(Vsup)

3.47 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

3 V

通道数量

1

模拟 IC - 其他类型

模拟电路

座位高度-最大

0.4 mm

宽度

6 mm

长度

6 mm

RoHS状态

符合RoHS标准