Microchip Technology M1A3P400-2FG144

包装/外壳

FPBGA-144

安装类型

表面贴装

表面安装

YES

供应商器件包装

144-FPBGA (13x13)

终端数量

144

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

N

Mounting Styles

SMD/SMT

Moisture Sensitive

有

Factory Pack QuantityFactory Pack Quantity

160

Tradename

ProASIC3

Device System Gates

400000

Device Logic Gates

400000

Number of I/Os

97

Package

Tray

Base Product Number

M1A3P400

厂商

微芯片技术

Product Status

活跃

Package Description

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

Package Style

GRID ARRAY, LOW PROFILE

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Risk Rank

5.24

Supply Voltage-Max

1.575 V

Ihs Manufacturer

MICROSEMI CORP

Part Life Cycle Code

活跃

Package Shape

SQUARE

Package Code

LBGA

Clock Frequency-Max

350 MHz

Manufacturer Part Number

M1A3P400-2FG144

Rohs Code

无

Operating Temperature-Max

85 °C

Supply Voltage-Min

1.425 V

Reflow Temperature-Max (s)

30

Supply Voltage-Nom

1.5 V

系列

M1A3P400

包装

Tray

操作温度

0°C ~ 85°C (TJ)

JESD-609代码

e0

端子表面处理

Tin/Lead/Silver (Sn/Pb/Ag)

HTS代码

8542.39.00.01

技术

CMOS

电压 - 供电

1.425V ~ 1.575V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

225

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B144

资历状况

不合格

温度等级

COMMERCIAL

组织结构

9216 CLBS, 400000 GATES

座位高度-最大

1.55 mm

可编程逻辑类型

现场可编程门阵列

总 RAM 位数

55296

阀门数量

400000

逻辑块数量

9216

等效门数

400000

宽度

13 mm

长度

13 mm