Microchip Technology M1A3P600-FGG144

包装/外壳

FBGA

安装类型

表面贴装

表面安装

YES

供应商器件包装

144-FPBGA (13x13)

终端数量

144

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

Details

Number of I/Os

97 I/O

Supply Voltage-Min

1.425 V

Minimum Operating Temperature

0 C

Maximum Operating Temperature

+ 70 C

Mounting Styles

SMD/SMT

Unit Weight

0.014110 oz

Tradename

ProASIC3

Factory Pack QuantityFactory Pack Quantity

160

Moisture Sensitive

有

Maximum Operating Frequency

231 MHz

Package

Tray

Base Product Number

M1A3P600

厂商

微芯片技术

Product Status

活跃

Supply Voltage-Max

1.575 V

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Supply Voltage-Nom

1.5 V

Reflow Temperature-Max (s)

40

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

M1A3P600-FGG144

Clock Frequency-Max

350 MHz

Package Code

LBGA

Package Shape

SQUARE

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.24

Package Style

GRID ARRAY, LOW PROFILE

Package Description

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

系列

M1A3P600

包装

Tray

操作温度

0°C ~ 85°C (TJ)

JESD-609代码

e1

端子表面处理

Tin/Silver/Copper (Sn/Ag/Cu)

HTS代码

8542.39.00.01

技术

CMOS

电压 - 供电

1.425V ~ 1.575V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

260

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B144

资历状况

不合格

工作电源电压

1.5 V

温度等级

COMMERCIAL

组织结构

13824 CLBS, 600000 GATES

座位高度-最大

1.55 mm

可编程逻辑类型

现场可编程门阵列

总 RAM 位数

110592

阀门数量

600000

速度等级

STD

逻辑块数量

13824

等效门数

600000

宽度

13 mm

长度

13 mm

高度

1.05 mm