Microchip Technology M1A3P600L-FG484I

包装/外壳

FBGA

安装类型

表面贴装

表面安装

YES

供应商器件包装

484-FPBGA (23x23)

终端数量

484

Shipping Restrictions

This product may require additional documentation to export from the United States.

Unit Weight

0.014110 oz

Tradename

ProASIC3

Factory Pack QuantityFactory Pack Quantity

60

Moisture Sensitive

有

Maximum Operating Frequency

781.25 MHz

Mounting Styles

SMD/SMT

Maximum Operating Temperature

+ 85 C

Minimum Operating Temperature

- 40 C

Supply Voltage-Min

1.14 V

Number of I/Os

235 I/O

RoHS

N

Typical Operating Supply Voltage

1.2000 V

Minimum Operating Supply Voltage

1.14 V

Maximum Operating Supply Voltage

1.26 V

Supply Voltage-Max

1.26 V

Package

Tray

Base Product Number

M1A3P600

厂商

微芯片技术

Product Status

活跃

Package Description

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

Package Style

网格排列

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA484,22X22,40

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

1.2 V

Reflow Temperature-Max (s)

30

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

M1A3P600L-FG484I

Clock Frequency-Max

350 MHz

Package Code

BGA

Package Shape

SQUARE

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.23

包装

Tray

系列

M1A3P600L

操作温度

-40 to 85 °C

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.39.00.01

技术

CMOS

电压 - 供电

1.2 V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

225

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B484

输出的数量

235

资历状况

不合格

电源

1.5/3.3 V

温度等级

INDUSTRIAL

输入数量

235

组织结构

13824 CLBS, 600000 GATES

座位高度-最大

2.44 mm

可编程逻辑类型

现场可编程门阵列

总 RAM 位数

110592

阀门数量

600000

速度等级

STD

逻辑块数量

13824

逻辑单元数

13824

等效门数

600000

宽度

23 mm

长度

23 mm

高度

1.73 mm