Microchip Technology M1A3PE1500-2FGG676I

包装/外壳

FBGA

安装类型

表面贴装

表面安装

YES

供应商器件包装

676-FBGA (27x27)

终端数量

676

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

Details

Number of I/Os

444 I/O

Supply Voltage-Min

1.425 V

Minimum Operating Temperature

- 40 C

Maximum Operating Temperature

+ 85 C

Mounting Styles

SMD/SMT

Maximum Operating Frequency

310 MHz

Moisture Sensitive

有

Factory Pack QuantityFactory Pack Quantity

40

Tradename

ProASIC3

Unit Weight

0.014110 oz

Typical Operating Supply Voltage

1.5000 V

Minimum Operating Supply Voltage

1.425 V

Maximum Operating Supply Voltage

1.575 V

Package

Tray

Base Product Number

M1A3PE1500

厂商

微芯片技术

Product Status

活跃

Supply Voltage-Max

1.575 V

Package Description

BGA, BGA676,26X26,40

Package Style

网格排列

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA676,26X26,40

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

1.5 V

Reflow Temperature-Max (s)

40

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

M1A3PE1500-2FGG676I

Clock Frequency-Max

350 MHz

Package Code

BGA

Package Shape

SQUARE

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.3

系列

M1A3PE1500

包装

Tray

操作温度

-40 to 85 °C

JESD-609代码

e1

端子表面处理

Tin/Silver/Copper (Sn/Ag/Cu)

HTS代码

8542.39.00.01

技术

CMOS

电压 - 供电

1.425V ~ 1.575V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

250

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B676

输出的数量

444

资历状况

不合格

工作电源电压

1.5 V

电源

1.5/3.3 V

温度等级

INDUSTRIAL

输入数量

444

组织结构

38400 CLBS, 1500000 GATES

座位高度-最大

2.44 mm

可编程逻辑类型

现场可编程门阵列

总 RAM 位数

276480

阀门数量

1500000

速度等级

2

逻辑块数量

38400

逻辑单元数

38400

等效门数

1500000

高度

1.73 mm

长度

27 mm

宽度

27 mm