Microchip Technology M1A3PE3000-1FGG484I

包装/外壳

FBGA

安装类型

表面贴装

表面安装

YES

供应商器件包装

484-FPBGA (23x23)

终端数量

484

Moisture Sensitive

有

Maximum Operating Frequency

272 MHz

Mounting Styles

SMD/SMT

Maximum Operating Temperature

+ 85 C

Minimum Operating Temperature

- 40 C

Supply Voltage-Min

1.425 V

Number of I/Os

341 I/O

RoHS

Details

Shipping Restrictions

This product may require additional documentation to export from the United States.

Unit Weight

0.014110 oz

Tradename

ProASIC3

Factory Pack QuantityFactory Pack Quantity

60

Typical Operating Supply Voltage

1.5000 V

Minimum Operating Supply Voltage

1.425 V

Maximum Operating Supply Voltage

1.575 V

Package

Tray

Base Product Number

M1A3PE3000

厂商

微芯片技术

Product Status

活跃

Supply Voltage-Max

1.575 V

Package Description

BGA, BGA484,22X22,40

Package Style

网格排列

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA484,22X22,40

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

1.5 V

Reflow Temperature-Max (s)

40

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

M1A3PE3000-1FGG484I

Clock Frequency-Max

350 MHz

Package Code

BGA

Package Shape

SQUARE

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.3

包装

Tray

系列

M1A3PE3000

操作温度

-40 to 85 °C

JESD-609代码

e1

端子表面处理

Tin/Silver/Copper (Sn/Ag/Cu)

HTS代码

8542.39.00.01

技术

CMOS

电压 - 供电

1.425V ~ 1.575V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

250

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B484

输出的数量

341

资历状况

不合格

工作电源电压

1.5 V

电源

1.5/3.3 V

温度等级

INDUSTRIAL

输入数量

341

组织结构

75264 CLBS, 3000000 GATES

座位高度-最大

2.44 mm

可编程逻辑类型

现场可编程门阵列

总 RAM 位数

516096

阀门数量

3000000

速度等级

1

逻辑块数量

75264

逻辑单元数

75264

等效门数

3000000

长度

23 mm

高度

1.73 mm

宽度

23 mm