Microchip Technology M1AFS250-FG256

包装/外壳

FBGA

安装类型

表面贴装

表面安装

YES

供应商器件包装

256-FPBGA (17x17)

终端数量

256

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

N

Number of I/Os

114 I/O

Supply Voltage-Min

1.425 V

Minimum Operating Temperature

0 C

Maximum Operating Temperature

+ 70 C

Mounting Styles

SMD/SMT

Maximum Operating Frequency

1098.9 MHz

Moisture Sensitive

有

Factory Pack QuantityFactory Pack Quantity

90

Tradename

Fusion

Unit Weight

0.014110 oz

Maximum Operating Supply Voltage

1.575 V

Minimum Operating Supply Voltage

1.425 V

Typical Operating Supply Voltage

1.5000 V

Package

Tray

Base Product Number

M1AFS250

厂商

微芯片技术

Product Status

活跃

Supply Voltage-Max

1.575 V

Package Description

FBGA-256

Package Style

GRID ARRAY, LOW PROFILE

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Supply Voltage-Nom

1.5 V

Reflow Temperature-Max (s)

30

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

M1AFS250-FG256

Package Code

LBGA

Package Shape

SQUARE

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.3

系列

M1AFS250

包装

Tray

操作温度

0 to 70 °C

端子表面处理

TIN LEAD/TIN LEAD SILVER

HTS代码

8542.39.00.01

技术

CMOS

电压 - 供电

1.425V ~ 1.575V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

225

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B256

资历状况

不合格

工作电源电压

1.5 V

温度等级

OTHER

组织结构

6144 CLBS, 250000 GATES

座位高度-最大

1.68 mm

可编程逻辑类型

现场可编程门阵列

总 RAM 位数

36864

阀门数量

250000

速度等级

STD

逻辑块数量

6144

等效门数

250000

高度

1.2 mm

长度

17 mm

宽度

17 mm