Microchip Technology M2GL005S-1TQG144

安装类型

表面贴装

包装/外壳

144-LQFP

表面安装

YES

供应商器件包装

144-TQFP (20x20)

终端数量

144

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

Details

Supply Voltage-Min

1.14 V

Moisture Sensitive

有

Factory Pack QuantityFactory Pack Quantity

60

Tradename

IGLOO2

Supply Voltage-Max

1.26 V

Number of I/Os

84

Package

Tray

Base Product Number

M2GL005

厂商

微芯片技术

Product Status

活跃

Package Description

LFQFP,

Package Style

FLATPACK, LOW PROFILE, FINE PITCH

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Supply Voltage-Nom

1.2 V

Reflow Temperature-Max (s)

30

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

M2GL005S-1TQG144

Package Code

LFQFP

Package Shape

SQUARE

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.57

系列

M2GL005S

包装

Tray

操作温度

0°C ~ 85°C (TJ)

电压 - 供电

1.14V ~ 2.625V

端子位置

QUAD

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

S-PQFP-G144

温度等级

OTHER

座位高度-最大

1.6 mm

可编程逻辑类型

现场可编程门阵列

逻辑元件/单元数

6060

总 RAM 位数

719872

宽度

20 mm

长度

20 mm