Microchip Technology M2GL005-VF256

安装类型

表面贴装

包装/外壳

256-LFBGA

表面安装

YES

供应商器件包装

256-FPBGA (14x14)

终端数量

256

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

N

Supply Voltage-Min

1.14 V

Moisture Sensitive

有

Factory Pack QuantityFactory Pack Quantity

119

Tradename

IGLOO2

Supply Voltage-Max

1.26 V

Number of I/Os

161

Package

Tray

Base Product Number

M2GL005

厂商

微芯片技术

Product Status

活跃

Package Description

LFBGA,

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Supply Voltage-Nom

1.2 V

Reflow Temperature-Max (s)

20

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

M2GL005-VF256

Package Code

LFBGA

Package Shape

SQUARE

Part Life Cycle Code

活跃

Samacsys Description

FPGA IGLOOu00ae2 Family 6060 Cells 1.2V 256-Pin VFBGA Tray

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.28

系列

M2GL005

包装

Tray

操作温度

0°C ~ 85°C (TJ)

HTS代码

8542.39.00.01

电压 - 供电

1.14V ~ 2.625V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

240

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B256

温度等级

OTHER

座位高度-最大

1.56 mm

可编程逻辑类型

现场可编程门阵列

逻辑元件/单元数

6060

总 RAM 位数

719872

宽度

14 mm

长度

14 mm