Microchip Technology M2GL010TS-VF256I

包装/外壳

VFPBGA-256

安装类型

表面贴装

表面安装

YES

供应商器件包装

256-FPBGA (14x14)

终端数量

256

Shipping Restrictions

This product may require additional documentation to export from the United States.

Factory Pack QuantityFactory Pack Quantity

119

Moisture Sensitive

有

Mounting Styles

SMD/SMT

Maximum Operating Temperature

+ 100 C

Minimum Operating Temperature

- 40 C

Supply Voltage-Min

1.2 V

Number of I/Os

138 I/O

Number of Logic Elements

12084 LE

RoHS

N

Tradename

IGLOO2

Supply Voltage-Max

1.2 V

Package

Tray

Base Product Number

M2GL010

厂商

微芯片技术

Product Status

活跃

Risk Rank

5.27

Ihs Manufacturer

MICROSEMI CORP

Part Life Cycle Code

活跃

Package Shape

SQUARE

Package Code

LFBGA

Manufacturer Part Number

M2GL010TS-VF256I

Rohs Code

无

Reflow Temperature-Max (s)

20

Supply Voltage-Nom

1.2 V

Package Body Material

PLASTIC/EPOXY

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Package Description

LFBGA,

包装

Tray

系列

M2GL010TS

操作温度

-40°C ~ 100°C (TJ)

HTS代码

8542.39.00.01

电压 - 供电

1.14V ~ 2.625V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

240

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B256

工作电源电压

1.2 V

座位高度-最大

1.56 mm

可编程逻辑类型

现场可编程门阵列

逻辑元件/单元数

12084

总 RAM 位数

933888

收发器数量

2 Transceiver

长度

14 mm

宽度

14 mm