Microchip Technology M2GL060TS-1FG484

包装/外壳

FPBGA-484

安装类型

表面贴装

表面安装

YES

供应商器件包装

484-FPBGA (23x23)

终端数量

484

Tradename

IGLOO2

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

N

Number of Logic Elements

56520 LE

Number of I/Os

267 I/O

Supply Voltage-Min

1.2 V

Minimum Operating Temperature

0 C

Maximum Operating Temperature

+ 85 C

Mounting Styles

SMD/SMT

Moisture Sensitive

有

Factory Pack QuantityFactory Pack Quantity

60

Supply Voltage-Max

1.2 V

Package

Tray

Base Product Number

M2GL060

厂商

微芯片技术

Product Status

活跃

Risk Rank

5.26

Ihs Manufacturer

MICROSEMI CORP

Part Life Cycle Code

活跃

Package Shape

SQUARE

Package Code

BGA

Manufacturer Part Number

M2GL060TS-1FG484

Rohs Code

无

Operating Temperature-Max

85 °C

Reflow Temperature-Max (s)

20

Supply Voltage-Nom

1.2 V

Package Body Material

PLASTIC/EPOXY

Moisture Sensitivity Levels

3

Package Style

网格排列

Package Description

23 X 23 MM, 1 MM PITCH, FBGA-484

系列

M2GL060TS

包装

Tray

操作温度

0°C ~ 85°C (TJ)

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn63Pb37)

HTS代码

8542.39.00.01

电压 - 供电

1.2 V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

240

端子间距

1 mm

Reach合规守则

not_compliant

JESD-30代码

S-PBGA-B484

温度等级

OTHER

座位高度-最大

2.44 mm

可编程逻辑类型

现场可编程门阵列

逻辑元件/单元数

56520

总 RAM 位数

1869824

收发器数量

4 Transceiver

长度

23 mm

宽度

23 mm