Microchip Technology M2GL090-FCSG325I

包装/外壳

FCBGA-325

安装类型

表面贴装

表面安装

YES

供应商器件包装

325-FCBGA (11x11)

终端数量

325

Tradename

IGLOO2

Factory Pack QuantityFactory Pack Quantity

176

Moisture Sensitive

有

Mounting Styles

SMD/SMT

Maximum Operating Temperature

+ 100 C

Minimum Operating Temperature

- 40 C

Supply Voltage-Min

1.2 V

Number of I/Os

180 I/O

Number of Logic Elements

86184 LE

RoHS

Details

Shipping Restrictions

This product may require additional documentation to export from the United States.

Supply Voltage-Max

1.2 V

Package

Tray

Base Product Number

M2GL090

厂商

微芯片技术

Product Status

活跃

Package Description

, BGA325,21X21,20

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC

Package Equivalence Code

BGA325,21X21,20

Supply Voltage-Nom

1.2 V

Rohs Code

有

Manufacturer Part Number

M2GL090-FCSG325I

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.3

包装

Tray

系列

M2GL090

操作温度

-40°C ~ 100°C (TJ)

HTS代码

8542.39.00.01

技术

CMOS

电压 - 供电

1.2 V

Reach合规守则

compliant

输出的数量

180

资历状况

不合格

电源

1.2 V

输入数量

180

可编程逻辑类型

现场可编程门阵列

逻辑元件/单元数

86184

总 RAM 位数

2648064

逻辑单元数

86316