Microchip Technology M2GL090TS-1FGG676T2

包装/外壳

FPBGA-676

安装类型

表面贴装

供应商器件包装

676-FBGA (27x27)

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

Details

Number of Logic Elements

86184 LE

Number of I/Os

425 I/O

Supply Voltage-Min

1.2 V

Minimum Operating Temperature

- 40 C

Maximum Operating Temperature

+ 125 C

Mounting Styles

SMD/SMT

Development Kit

M2GL-EVAL-KIT

Maximum Operating Frequency

200 MHz

Factory Pack QuantityFactory Pack Quantity

40

Total Memory

2586 kbit

Tradename

IGLOO2

Typical Operating Supply Voltage

1.2000 V

Supply Voltage-Max

1.2 V

Package

Tray

Base Product Number

M2GL090

厂商

微芯片技术

Product Status

活跃

Package Description

,

Reflow Temperature-Max (s)

未说明

Rohs Code

有

Manufacturer Part Number

M2GL090TS-1FGG676T2

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

2.4

系列

M2GL090TS

包装

Tray

操作温度

-40 to 125 °C

无铅代码

有

电压 - 供电

1.14V ~ 2.625V

峰值回流焊温度（摄氏度）

未说明

Reach合规守则

compliant

工作电源电压

1.2 V

数据率

3.125 Gb/s

可编程逻辑类型

现场可编程门阵列

逻辑元件/单元数

86316

总 RAM 位数

2648064

速度等级

1

收发器数量

4 Transceiver