Microchip Technology M2GL090TS-1FGG676T2

包装/外壳

FPBGA-676

安装类型

表面贴装

供应商器件包装

676-FBGA (27x27)

Maximum Operating Frequency

200 MHz

Factory Pack QuantityFactory Pack Quantity

40

Total Memory

2586 kbit

Tradename

IGLOO2

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

Details

Number of Logic Elements

86184 LE

Number of I/Os

425 I/O

Supply Voltage-Min

1.2 V

Minimum Operating Temperature

- 40 C

Maximum Operating Temperature

+ 125 C

Mounting Styles

SMD/SMT

Development Kit

M2GL-EVAL-KIT

Typical Operating Supply Voltage

1.2000 V

Supply Voltage-Max

1.2 V

Package

Tray

Base Product Number

M2GL090

厂商

微芯片技术

Product Status

活跃

Package Description

,

Reflow Temperature-Max (s)

未说明

Rohs Code

有

Manufacturer Part Number

M2GL090TS-1FGG676T2

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

2.4

系列

M2GL090TS

包装

Tray

操作温度

-40 to 125 °C

无铅代码

有

电压 - 供电

1.2 V

峰值回流焊温度（摄氏度）

未说明

Reach合规守则

compliant

数据率

3.125 Gb/s

可编程逻辑类型

现场可编程门阵列

逻辑元件/单元数

86316

总 RAM 位数

2648064

速度等级

1

收发器数量

4 Transceiver