Microchip Technology M2GL150T-1FCV484M

包装/外壳

BGA-484

安装类型

表面贴装

表面安装

YES

供应商器件包装

484-FBGA (19x19)

终端数量

484

Shipping Restrictions

This product may require additional documentation to export from the United States.

Number of Logic Elements

146124 LE

Number of I/Os

248 I/O

Maximum Operating Temperature

+ 85 C

Supply Voltage-Max

1.26 V

Minimum Operating Temperature

0 C

Factory Pack QuantityFactory Pack Quantity

84

Supply Voltage-Min

1.14 V

Mounting Styles

SMD/SMT

Number of Logic Array Blocks - LABs

240 LAB

Manufacturer

Microchip

Brand

微芯片技术

Tradename

IGLOO2

RoHS

N

Package

Tray

厂商

微芯片技术

Product Status

活跃

Package Description

VFBGA-484

Package Style

GRID ARRAY, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-55 °C

Supply Voltage-Nom

1.2 V

Reflow Temperature-Max (s)

未说明

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

M2GL150T-1FCV484M

Package Code

FBGA

Package Shape

SQUARE

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.85

系列

M2GL150T

包装

Tray

操作温度

-55°C ~ 125°C (TJ)

子类别

可编程逻辑集成电路

电压 - 供电

1.14V ~ 2.625V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

未说明

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B484

工作电源电压

1.14 V to 1.26 V

温度等级

MILITARY

座位高度-最大

3.15 mm

可编程逻辑类型

现场可编程门阵列

逻辑元件/单元数

146124

产品类别

FPGA - Field Programmable Gate Array

总 RAM 位数

5120000

阀门数量

4 Gate

产品类别

FPGA - Field Programmable Gate Array

宽度

19 mm

长度

19 mm