Microchip Technology M2GL150TS-1FCSG536I

生命周期状态

Production (Last Updated: 2 months ago)

安装类型

表面贴装

包装/外壳

536-LFBGA, CSPBGA

表面安装

YES

供应商器件包装

536-CSPBGA (16x16)

终端数量

536

Shipping Restrictions

This product may require additional documentation to export from the United States.

Tradename

IGLOO2

Factory Pack QuantityFactory Pack Quantity

90

Moisture Sensitive

有

RoHS

Details

Number of I/Os

293

Package

Tray

Base Product Number

M2GL150

厂商

微芯片技术

Product Status

活跃

Package Description

BGA,

Package Style

网格排列

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Supply Voltage-Nom

1.2 V

Reflow Temperature-Max (s)

30

Supply Voltage-Min

1.14 V

Rohs Code

有

Manufacturer Part Number

M2GL150TS-1FCSG536I

Package Code

BGA

Package Shape

SQUARE

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Supply Voltage-Max

1.26 V

Risk Rank

5.27

包装

Tray

系列

M2GL150TS

操作温度

-40°C ~ 100°C (TJ)

HTS代码

8542.39.00.01

电压 - 供电

1.14V ~ 2.625V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

260

Reach合规守则

compliant

JESD-30代码

S-PBGA-B536

可编程逻辑类型

现场可编程门阵列

逻辑元件/单元数

146124

总 RAM 位数

5120000