Microchip Technology MAX24287ETK T

表面安装

YES

终端数量

68

ECCN (US)

EAR99

Interface Type

Serial

Minimum Operating Supply Voltage (V)

3.135|1.14

Typical Operating Supply Voltage (V)

1.2|3.3

Maximum Operating Supply Voltage (V)

3.465|1.26

Maximum Supply Current (mA)

205

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Standard Package Name

QFN

Supplier Package

TQFN EP

Mounting

表面贴装

Package Height

0.73

Package Length

8

Package Width

8

PCB changed

68

Lead Shape

No Lead

Package Description

HVQCCN, LCC68,.32SQ,16

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Package Body Material

UNSPECIFIED

Package Equivalence Code

LCC68,.32SQ,16

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

1.2 V

Reflow Temperature-Max (s)

未说明

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

MAX24287ETK+T

Package Code

HVQCCN

Package Shape

SQUARE

Manufacturer

Microsemi Corporation

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.61

Part Package Code

QFN

包装

卷带

零件状态

活跃

应用

SONET

HTS代码

8542.39.00.01

端子位置

QUAD

终端形式

无铅

峰值回流焊温度（摄氏度）

未说明

功能数量

1

端子间距

0.4 mm

Reach合规守则

compliant

引脚数量

68

JESD-30代码

S-XQCC-N68

温度等级

INDUSTRIAL

数据率

1000000 Mbps

座位高度-最大

0.8 mm

通信IC类型

支持回路

宽度

8 mm

长度

8 mm

RoHS状态

符合RoHS标准