Microchip Technology MPF200T-FCG784I

包装/外壳

BGA-784

安装类型

表面贴装

表面安装

YES

供应商器件包装

784-FCBGA (29x29)

终端数量

784

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

Details

Number of Logic Elements

192000 LE

Number of I/Os

364 I/O

Supply Voltage-Min

970 mV/1.02 V

Minimum Operating Temperature

- 40 C

Maximum Operating Temperature

+ 100 C

Mounting Styles

SMD/SMT

Moisture Sensitive

有

Factory Pack QuantityFactory Pack Quantity

1

Tradename

PolarFire

Unit Weight

2.674354 oz

Package

Tray

Base Product Number

MPF200

厂商

微芯片技术

Product Status

活跃

Supply Voltage-Max

1.03 V/1.08 V

Package Description

BGA,

Package Style

网格排列

Moisture Sensitivity Levels

4

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

1 V

Reflow Temperature-Max (s)

未说明

Operating Temperature-Max

100 °C

Rohs Code

有

Manufacturer Part Number

MPF200T-FCG784I

Package Code

BGA

Package Shape

SQUARE

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.8

系列

MPF200T

包装

Tray

操作温度

-40°C ~ 100°C (TJ)

附加功能

CAN ALSO BE OPERATED AT 1.05 VDD NOMINAL

电压 - 供电

0.97V ~ 1.08V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

260

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B784

工作电源电压

1 V, 1.05 V

温度等级

INDUSTRIAL

数据率

12.7 Gb/s

座位高度-最大

3.47 mm

可编程逻辑类型

现场可编程门阵列

逻辑元件/单元数

192000

总 RAM 位数

13619200

收发器数量

16 Transceiver

宽度

29 mm

长度

29 mm