Microchip Technology MPF300T-FCG484I

包装/外壳

BGA-484

安装类型

表面贴装

表面安装

YES

供应商器件包装

484-FCBGA (23x23)

终端数量

484

RoHS

Details

Number of Logic Elements

300000 LE

Number of I/Os

244 I/O

Supply Voltage-Min

0.97 V

Minimum Operating Temperature

- 40 C

Maximum Operating Temperature

+ 100 C

Mounting Styles

SMD/SMT

Moisture Sensitive

有

Factory Pack QuantityFactory Pack Quantity

1

Total Memory

20.6 Mbit

Tradename

PolarFire

Unit Weight

0.892167 oz

Supply Voltage-Max

1.08 V

Package

Tray

Base Product Number

MPF300

厂商

微芯片技术

Product Status

活跃

Package Description

BGA-484

Package Style

网格排列

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

1 V

Operating Temperature-Max

100 °C

Rohs Code

有

Manufacturer Part Number

MPF300T-FCG484I

Package Code

BGA

Package Shape

SQUARE

Part Life Cycle Code

活跃

Samacsys Description

FPGA PolarFire Family 300000 Cells 28nm Technology 484-Pin FBGA Tray

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

2.36

系列

MPF300T

包装

Tray

操作温度

-40°C ~ 100°C (TJ)

附加功能

IT ALSO OPERATES AT 1.05 V NOM SUPPLY

技术

CMOS

电压 - 供电

0.97V ~ 1.08V

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B484

工作电源电压

1 V, 1.05 V

温度等级

INDUSTRIAL

数据率

12.5 Gb/s

座位高度-最大

2.87 mm

可编程逻辑类型

现场可编程门阵列

逻辑元件/单元数

300000

总 RAM 位数

21094.4Kbit

收发器数量

8 Transceiver

宽度

23 mm

长度

23 mm