Microchip Technology MPF300TL-FCSG536I

包装/外壳

BGA-536

安装类型

表面贴装

表面安装

YES

供应商器件包装

536-CSPBGA (16x16)

终端数量

536

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

Details

Number of Logic Elements

300000 LE

Number of I/Os

300 I/O

Supply Voltage-Min

0.97 V

Minimum Operating Temperature

- 40 C

Maximum Operating Temperature

+ 100 C

Mounting Styles

SMD/SMT

Moisture Sensitive

有

Factory Pack QuantityFactory Pack Quantity

1

Total Memory

20.6 Mbit

Tradename

PolarFire

Supply Voltage-Max

1.08 V

Package

Tray

Base Product Number

MPF300

厂商

微芯片技术

Product Status

活跃

Package Description

LFBGA,

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

1 V

Operating Temperature-Max

100 °C

Rohs Code

有

Manufacturer Part Number

MPF300TL-FCSG536I

Package Code

LFBGA

Package Shape

SQUARE

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.79

系列

MPF300TL

包装

Tray

操作温度

-40°C ~ 100°C (TJ)

附加功能

CAN ALSO BE OPERATED AT 1.05 VDD NOMINAL

电压 - 供电

0.97V ~ 1.08V

端子位置

BOTTOM

终端形式

BALL

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B536

工作电源电压

1 V, 1.05 V

温度等级

INDUSTRIAL

数据率

12.5 Gb/s

座位高度-最大

1.45 mm

可编程逻辑类型

现场可编程门阵列

逻辑元件/单元数

300000

总 RAM 位数

21094400

收发器数量

4 Transceiver

宽度

16 mm

长度

16 mm