Microchip Technology MPF500TS-FC1152M

安装类型

表面贴装

包装/外壳

1152-BBGA, FCBGA

表面安装

YES

供应商器件包装

1152-FCBGA (35x35)

终端数量

1152

Shipping Restrictions

This product may require additional documentation to export from the United States.

Supply Voltage-Min

970 mV/1.02 V

Factory Pack QuantityFactory Pack Quantity

1

Supply Voltage-Max

1.03 V/1.08 V

Number of I/Os

584

Package

Tray

厂商

微芯片技术

Product Status

活跃

Package Description

BGA,

Package Style

网格排列

Package Body Material

PLASTIC/EPOXY

Supply Voltage-Nom

1 V

Manufacturer Part Number

MPF500TS-FC1152M

Package Code

BGA

Package Shape

SQUARE

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.79

系列

MPF500TS

包装

Tray

操作温度

-55°C ~ 125°C (TJ)

附加功能

IT ALSO OPERATES AT 1.05 V SUPPLY

电压 - 供电

0.97V ~ 1.08V

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B1152

工作电源电压

1.05 V

座位高度-最大

2.9 mm

可编程逻辑类型

现场可编程门阵列

逻辑元件/单元数

481000

总 RAM 位数

34603008

宽度

35 mm

长度

35 mm