Microchip Technology U2760B-AFSG3

表面安装

YES

终端数量

28

Manufacturer Part Number

U2760B-AFSG3

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

TELEFUNKEN MICROELECTRONICS GMBH

Risk Rank

5.77

Operating Temperature-Max

45 °C

Operating Temperature-Min

-5 °C

Package Body Material

PLASTIC/EPOXY

Package Code

SSOP

Package Equivalence Code

SSOP28,.25

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, SHRINK PITCH

Supply Voltage-Nom

2.9 V

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

鸥翼

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G28

资历状况

不合格

电源

2.9 V

温度等级

COMMERCIAL