Microchip Technology Inc AT45DB321E-MHF-Y

表面安装

YES

材料

Polyolefin

终端数量

8

Diameter before shrinkage

3.5 mm

Diameter after shrinkage

1.75 mm

Thickness after shrinkage

0.42 mm

Gross weight

4.70

Transport packaging size/quantity

105*20*16/1000

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICROCHIP TECHNOLOGY INC

Package Description

5 X 6 MM, 0.60 MM HEIGHT, GREEN, PLASTIC, MO-229, UDFN-8

Clock Frequency-Max (fCLK)

70 MHz

Number of Words

33554432 words

Number of Words Code

32000000

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

HVSON

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Supply Voltage-Nom (Vsup)

3 V

JESD-609代码

e4

ECCN 代码

EAR99

类型

NOR型号

端子表面处理

镍钯金

颜色

red

HTS代码

8542.32.00.51

端子位置

DUAL

终端形式

无铅

功能数量

1

端子间距

1.27 mm

Reach合规守则

compliant

JESD-30代码

R-PDSO-N8

Working voltage

600 V

电源电压-最大值(Vsup)

3.6 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

2.3 V

操作模式

SYNCHRONOUS

组织结构

32MX1

座位高度-最大

0.6 mm

内存宽度

1

Operating temperature range

-55...+125 °C

记忆密度

33554432 bit

并行/串行

SERIAL

内存IC类型

FLASH

编程电压

2.7 V

Shrinkage ratio

2 : 1

Shrink temperature

+80...+120 °C

饱和电流

1

长度

6 mm

宽度

5 mm