Microchip Technology Inc ATSAMV71N19A-CB

表面安装

YES

终端数量

100

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROCHIP TECHNOLOGY INC

Package Description

TFBGA-100

Clock Frequency-Max

20 MHz

Number of I/O Lines

75

Operating Temperature-Max

105 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TFBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

ROM(word)

524288

Supply Voltage-Max

1.32 V

Supply Voltage-Min

1.08 V

Supply Voltage-Nom

1.2 V

附加功能

ALSO HAVING THREE USART SPI AND 16 KBYTES ROM WITH EMBEDDED BOOT LOADER.

HTS代码

8542.31.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B100

温度等级

INDUSTRIAL

速度

300 MHz

uPs/uCs/外围ICs类型

MICROCONTROLLER, RISC

位元大小

32

有ADC

YES

DMA 通道

YES

脉宽调制通道

YES

数模转换器通道

YES

座位高度-最大

1.1 mm

片上程序 ROM 宽度

8

筛选水平

AEC-Q100; TS 16949

只读存储器可编程性

FLASH

长度

9 mm

宽度

9 mm