Microchip Technology Inc COM2661-3

表面安装

NO

终端数量

28

Rohs Code

无

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROCHIP TECHNOLOGY INC

Operating Temperature-Max

70 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP28,.6

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Max

5.25 V

Supply Voltage-Min

4.75 V

Supply Voltage-Nom

5 V

HTS代码

8542.31.00.01

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T28

资历状况

不合格

温度等级

COMMERCIAL

uPs/uCs/外围ICs类型

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

边界扫描

NO

外部数据总线宽度

8

串行I/O数

1

通信协议

ASYNC, BIT; SYNC, BYTE; BISYNC