Microchip Technology Inc RTSX72SU-1CQ208B

表面安装

YES

Contact plating

gold-plated

Number of pins

94

终端数量

208

Rohs Code

无

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROCHIP TECHNOLOGY INC

Package Description

CERAMIC, QFP-208

Clock Frequency-Max

310 MHz

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Package Code

HGQFF

Package Equivalence Code

TPAK208,2.9SQ,20

Package Shape

SQUARE

Package Style

FLATPACK, HEAT SINK/SLUG, GUARD RING

Supply Voltage-Max

2.75 V

Supply Voltage-Min

2.25 V

Supply Voltage-Nom

2.5 V

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

2x47

Row pitch

2.54mm

Gross weight

8.93 g

Operating temperature

-40...163°C

JESD-609代码

e0

ECCN 代码

3A001.A.2.C

附加功能

72000 TYPICAL GATES AVAILABLE

HTS代码

8542.39.00.01

端子位置

QUAD

终端形式

FLAT

峰值回流焊温度（摄氏度）

225

端子间距

0.5 mm

Reach合规守则

compliant

Current rating

1.5A

时间@峰值回流温度-最大值(s)

20

JESD-30代码

S-CQFP-F208

输出的数量

360

资历状况

不合格

温度等级

MILITARY

输入数量

360

组织结构

6036 CLBS, 108000 GATES

座位高度-最大

3.3 mm

可编程逻辑类型

现场可编程门阵列

筛选水平

MIL-STD-883 Class B

CLB-Max的组合延时

1.2 ns

逻辑块数量

6036

逻辑单元数

6036

Rated voltage

60V

等效门数

108000

个人资料

beryllium copper

总剂量

100k Rad(Si) V

长度

29.21 mm

宽度

29.21 mm

Plating thickness

0.75µm

Flammability rating

UL94V-0