Micro Commercial Components MD60S08M2-BP

表面安装

NO

二极管元件材料

SILICON

终端数量

5

Factory Pack QuantityFactory Pack Quantity

8

Manufacturer

Micro Commercial Components (MCC)

Brand

Micro Commercial Components (MCC)

RoHS

Details

Package Description

R-XUFM-X5

Package Style

FLANGE MOUNT

Package Body Material

UNSPECIFIED

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

10

Operating Temperature-Max

150 °C

Rohs Code

有

Manufacturer Part Number

MD60S08M2-BP

Package Shape

RECTANGULAR

Number of Elements

6

Part Life Cycle Code

活跃

Ihs Manufacturer

MICRO COMMERCIAL COMPONENTS CORP

Risk Rank

5.78

包装

Bulk

JESD-609代码

e4

ECCN 代码

EAR99

端子表面处理

Silver (Ag)

子类别

Discrete Semiconductor Modules

端子位置

UPPER

终端形式

UNSPECIFIED

峰值回流焊温度（摄氏度）

260

Reach合规守则

not_compliant

JESD-30代码

R-XUFM-X5

配置

BRIDGE, 6 ELEMENTS

二极管类型

桥式整流二极管

箱体转运

ISOLATED

输出电流-最大值

60 A

产品类别

Discrete Semiconductor Modules

相位的数量

3

Rep Pk反向电压-最大值

800 V

最大非代表Pk前进电流

460 A

击穿电压-最小值

800 V

产品类别

MCC