Micron MT29C8G96MAYBADKD-5WT

表面安装

YES

终端数量

137

Package Description

TFBGA,

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Number of Words Code

64000000

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-25 °C

Operating Temperature-Max

85 °C

Manufacturer Part Number

MT29C8G96MAYBADKD-5WT

Number of Words

67108864 words

Supply Voltage-Nom (Vsup)

1.8 V

Package Code

TFBGA

Package Shape

RECTANGULAR

Manufacturer

Micron Technology Inc

Part Life Cycle Code

活跃

Ihs Manufacturer

MICRON TECHNOLOGY INC

Risk Rank

5.69

附加功能

ALSO ORGANISED AS 128M X 16

HTS代码

8542.32.00.71

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B137

电源电压-最大值(Vsup)

1.95 V

温度等级

OTHER

电源电压-最小值(Vsup)

1.7 V

操作模式

SYNCHRONOUS

组织结构

64MX32

座位高度-最大

1.1 mm

内存宽度

32

记忆密度

2147483648 bit

内存IC类型

存储器电路

宽度

10.5 mm

长度

13 mm