Micron MT48H16M16LFBF-75AT:H

表面安装

YES

终端数量

54

Package Description

FBGA, BGA54,9X9,32

Package Style

GRID ARRAY, FINE PITCH

Number of Words Code

16000000

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA54,9X9,32

Operating Temperature-Min

-40 °C

Access Time-Max

5.4 ns

Operating Temperature-Max

105 °C

Rohs Code

有

Manufacturer Part Number

MT48H16M16LFBF-75AT:H

Clock Frequency-Max (fCLK)

133 MHz

Number of Words

16777216 words

Supply Voltage-Nom (Vsup)

1.8 V

Package Code

FBGA

Package Shape

SQUARE

Manufacturer

Micron Technology Inc

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICRON TECHNOLOGY INC

Risk Rank

5.84

子类别

DRAMs

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B54

资历状况

不合格

电源

1.8 V

温度等级

INDUSTRIAL

电源电流-最大值

0.085 mA

组织结构

16MX16

输出特性

3-STATE

内存宽度

16

待机电流-最大值

0.00001 A

记忆密度

268435456 bit

I/O类型

COMMON

内存IC类型

同步剧

刷新周期

8192

顺序突发长度

1,2,4,8,FP

交错突发长度

1,2,4,8