Micron MTFC16GJTEC-WT

表面安装

YES

终端数量

169

Package Description

FBGA, BGA169,14X28,20

Package Style

GRID ARRAY, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA169,14X28,20

Operating Temperature-Min

-25 °C

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

MTFC16GJTEC-WT

Package Code

FBGA

Package Shape

RECTANGULAR

Manufacturer

Micron Technology Inc

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICRON TECHNOLOGY INC

Risk Rank

5.8

子类别

其他存储器集成电路

端子位置

BOTTOM

终端形式

BALL

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

R-PBGA-B169

资历状况

不合格

电源

1.8/3.3,3/3.3 V

温度等级

OTHER

记忆密度

137438953472 bit

混合内存类型

N/A