Micron MTFC32GAKAECN-3MWT

表面安装

YES

终端数量

153

Package Description

11.50 X 13 MM, 1 MM HEIGHT, GREEN, VFBGA-153

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-25 °C

Reflow Temperature-Max (s)

30

Supply Voltage-Min

1.65 V

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

MTFC32GAKAECN-3MWT

Package Code

VFBGA

Package Shape

RECTANGULAR

Manufacturer

Micron Technology Inc

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICRON TECHNOLOGY INC

Supply Voltage-Max

1.95 V

Risk Rank

5.66

JESD-609代码

e1

端子表面处理

锡银铜

附加功能

IT ALSO OPERATES AT 2.7V TO 3.6 V

HTS代码

8542.31.00.01

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

260

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B153

温度等级

OTHER

uPs/uCs/外围ICs类型

SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE

座位高度-最大

1 mm

外部数据总线宽度

8

主机数据传输速率-最大

250 MBps

宽度

11.5 mm

长度

13 mm