Micron NAND32GAH0HZA5E

表面安装

YES

终端数量

169

Package Style

GRID ARRAY, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA169,14X28,20

Operating Temperature-Min

-25 °C

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

NAND32GAH0HZA5E

Package Code

FBGA

Package Shape

RECTANGULAR

Manufacturer

Micron Technology Inc

Part Life Cycle Code

活跃

Ihs Manufacturer

MICRON TECHNOLOGY INC

Risk Rank

5.69

子类别

其他存储器集成电路

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B169

资历状况

不合格

电源

1.8/3.3,3.3 V

温度等级

OTHER

电源电流-最大值

0.15 mA

记忆密度

4294967296 bit