Micron NANDA9R3N6CZBB5E

表面安装

YES

终端数量

107

RoHS

Compliant

Package Style

GRID ARRAY, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA107,10X14,32

Operating Temperature-Min

-30 °C

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

NANDA9R3N6CZBB5E

Supply Voltage-Nom (Vsup)

1.8 V

Package Code

FBGA

Package Shape

RECTANGULAR

Manufacturer

Micron Technology Inc

Part Life Cycle Code

活跃

Ihs Manufacturer

MICRON TECHNOLOGY INC

Risk Rank

5.68

子类别

其他存储器集成电路

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B107

资历状况

不合格

电源

1.8 V

温度等级

OTHER

内存IC类型

存储器电路

混合内存类型

FLASH+SDRAM