Micron Technology M36W0R6040B3ZAQF

表面安装

YES

终端数量

88

Package Description

FBGA, BGA88,8X12,32

Package Style

GRID ARRAY, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA88,8X12,32

Operating Temperature-Min

-30 °C

Access Time-Max

70 ns

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

M36W0R6040B3ZAQF

Supply Voltage-Nom (Vsup)

1.8 V

Package Code

FBGA

Package Shape

RECTANGULAR

Manufacturer

Micron Technology Inc

Part Life Cycle Code

活跃

Ihs Manufacturer

MICRON TECHNOLOGY INC

Risk Rank

5.67

子类别

其他存储器集成电路

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

JESD-30代码

R-PBGA-B88

资历状况

不合格

电源

1.8 V

温度等级

OTHER

待机电流-最大值

0.00011 A

内存IC类型

存储器电路

混合内存类型

FLASH+PSRAM

达到SVHC

compliant