Micron Technology MT16JSF25664HY-1G1D1

表面安装

NO

终端数量

204

ECCN (US)

EAR99

HTS

8473.30.11.40

Module

DRAM模块

Module Density

2Gbyte

Number of Chip per Module

16

Chip Density (bit)

1G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

1066

Chip Configuration

128Mx8

Minimum Operating Supply Voltage (V)

1.425

Typical Operating Supply Voltage (V)

1.5

Maximum Operating Supply Voltage (V)

1.575

Operating Current (mA)

1616

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

70

Supplier Temperature Grade

Commercial

Module Sides

Double

ECC Support

无

Number of Ranks

Dual

Number of Chip Banks

8

CAS Latency

7

PC Type

PC3-12800

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

SODIMM

Mounting

Socket

Package Height

30.15(Max)

Package Length

67.75(Max)

Package Width

3.8(Max)

PCB changed

204

Lead Shape

No Lead

Package Description

DIMM,

Package Style

微电子组件

Number of Words Code

256000000

Package Body Material

UNSPECIFIED

Reflow Temperature-Max (s)

30

Operating Temperature-Max

70 °C

Rohs Code

有

Manufacturer Part Number

MT16JSF25664HY-1G1D1

Number of Words

268435456 words

Supply Voltage-Nom (Vsup)

1.5 V

Package Code

DIMM

Package Shape

RECTANGULAR

Manufacturer

Micron Technology Inc

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICRON TECHNOLOGY INC

Risk Rank

8.41

Part Package Code

SODIMM

JESD-609代码

e4

零件状态

Obsolete

ECCN 代码

EAR99

端子表面处理

Gold (Au)

附加功能

AUTO/SELF REFRESH

HTS代码

8542.32.00.36

技术

CMOS

端子位置

ZIG-ZAG

终端形式

无铅

峰值回流焊温度（摄氏度）

260

功能数量

1

Reach合规守则

unknown

引脚数量

204

JESD-30代码

R-XZMA-N204

资历状况

不合格

电源电压-最大值(Vsup)

1.575 V

温度等级

COMMERCIAL

电源电压-最小值(Vsup)

1.425 V

端口的数量

1

操作模式

SYNCHRONOUS

组织结构

256Mx64

内存宽度

64

记忆密度

17179869184 bit

锁相环

无

内存IC类型

DDR内存模块

刷新周期

8K

访问模式

双库页面突发

自我刷新

有

模块类型

204SODIMM

RoHS状态

是,有豁免