Micron Technology MT16LSDT1664AG-13EG8

ECCN (US)

EAR99

HTS

8542.32.00.02

Module

DRAM模块

Module Density

128Mbyte

Number of Chip per Module

16

Chip Density (bit)

64M

Data Bus Width (bit)

64

Max. Access Time (ns)

5.4

Maximum Clock Rate (MHz)

133

Chip Configuration

8Mx8

Minimum Operating Supply Voltage (V)

3

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

1216

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

65

Supplier Temperature Grade

Commercial

Module Sides

Double

ECC Support

无

Number of Ranks

Dual

Number of Chip Banks

4

CAS Latency

2

PC Type

PC-133

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

UDIMM

Mounting

Socket

Package Height

35.05(Max)

Package Length

133.5(Max)

Package Width

3.99(Max)

PCB changed

168

Lead Shape

No Lead

包装

Tray

零件状态

Obsolete

引脚数量

168

组织结构

16Mx64

锁相环

无

刷新周期

4K

自我刷新

有

模块类型

168UDIMM

RoHS状态

RoHS non-compliant