Micron Technology MT16LSDT6464AG-133C2

ECCN (US)

EAR99

Module

DRAM模块

Module Density

512Mbyte

Number of Chip per Module

16

Chip Density (bit)

256M

Data Bus Width (bit)

64

Max. Access Time (ns)

6|5.4

Maximum Clock Rate (MHz)

133

Chip Configuration

32Mx8

Minimum Operating Supply Voltage (V)

3

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

1096

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

70

Supplier Temperature Grade

Commercial

ECC Support

无

Number of Ranks

Dual

CAS Latency

3

Standard Package Name

DIM

Supplier Package

DIMM

Mounting

Socket

Package Height

28.73(Max)

Package Length

133.5(Max)

Package Width

3.18(Max)

PCB changed

168

Lead Shape

No Lead

包装

Tray

零件状态

Unconfirmed

引脚数量

168

组织结构

64Mx64

刷新周期

8K

自我刷新

有

模块类型

168UDIMM

RoHS状态

RoHS non-compliant