Micron Technology MT18JSF25672AY-1G1D1

底架

Socket

引脚数

240

ECCN (US)

EAR99

HTS

8542.32.00.02

Module

DRAM模块

Module Density

2Gbyte

Number of Chip per Module

18

Chip Density (bit)

1G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

1066

Chip Configuration

128Mx8

Minimum Operating Supply Voltage (V)

1.425

Typical Operating Supply Voltage (V)

1.5

Maximum Operating Supply Voltage (V)

1.575

Operating Current (mA)

1530

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

70

Supplier Temperature Grade

Commercial

Module Sides

Double

ECC Support

有

Number of Ranks

Dual

Number of Chip Banks

8

CAS Latency

7

PC Type

PC3-8500

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

UDIMM

Mounting

Socket

Package Height

29.85(Max)

Package Length

133.5(Max)

Package Width

4(Max)

PCB changed

240

Lead Shape

No Lead

Number of Elements

18

RoHS

Compliant

包装

Tray

零件状态

Obsolete

最高工作温度

70 °C

最小工作温度

0 °C

引脚数量

240

工作电源电压

1.5 V

最大电源电压

1.575 V

最小电源电压

1.425 V

组织结构

256Mx72

最高频率

1.066 GHz

锁相环

无

刷新周期

8K

自我刷新

有

模块类型

240UDIMM

RoHS状态

是,有豁免

辐射硬化

无