Micron Technology MT18LSDT3272Y-133G2

ECCN (US)

EAR99

Module

DRAM模块

Module Density

256Mbyte

Number of Chip per Module

18

Chip Density (bit)

128M

Data Bus Width (bit)

72

Max. Access Time (ns)

6|5.4

Maximum Clock Rate (MHz)

133

Chip Configuration

32Mx4

Minimum Operating Supply Voltage (V)

3

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

2700

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

55

Supplier Temperature Grade

Commercial

Module Sides

Double

ECC Support

有

Number of Ranks

Single

Number of Chip Banks

4

CAS Latency

3

PC Type

PC-133

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

RDIMM

Mounting

Socket

Package Height

30.63(Max)

Package Length

133.5(Max)

Package Width

4(Max)

PCB changed

168

Lead Shape

No Lead

包装

Tray

零件状态

Obsolete

引脚数量

168

组织结构

32Mx72

锁相环

有

刷新周期

4K

自我刷新

有

模块类型

168RDIMM

RoHS状态

是,有豁免